Features of Pulse Heat Joining:
- When soldering or thermo-compression joining of flexible circuits, such as the TAB or the FPC, highly reliable joining can be realized without lifting up or misalignment by employing the pulse heat method where heating and cooling are conducted while the pressure is being applied.
- When the connection pads are arranged in a matrix form, the joining area becomes large and uniform heat and pressure distribution will be important.
- Because of the local heating, thermal damage to the camera sensor can be kept to a minimum.
Mobile Phone/Module Mounting
Camera Module
Joining of Camera and the FPC (Driver Circuit)
CMOS or CCD image sensors mounted on mobile phones or digital cameras become modules when they are gang soldered onto a FPC by the pulse heating method.
Applicable Machine Models:
- Pulse Heat Power Supply, General Purpose Type TCW-315
- Pulse Heat Power Supply, High Power Type PHU-35
- Pulse Heat System Heat NA-11 Series & NA-15 Series
For configuration assistance, please contact SOLTEC