Hermetic Sealing of Optical Device and Hybrid IC

Features of the joining method

  • It can be applied to hermetic sealing of packages with various shapes and sizes.
  • Vacuum sealing, in addition to N2 sealing, can be made.
  • As the seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.

 

Applicable to various package types

  1. Pin grid array（Large sized ceramic PKG）
  2. Hybrid IC（Large sized metal PKG）
  3. Optical device（PKG with glass window）
  4. Device for optical communication（Metal PKG）
  5. Custom LSI（Round shaped seam PKG）
                 PKG : package


Related Videos

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Micro-joining application: Seam welding of optical device and hybrid IC

Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.

 

Aplicable machine models

  • Seam Welder; In N2 gas Type/Semi-Automatic Type
  • Seam Welder; In Vacuum Type/Semi-Automatic Type

 

For configuration assistance, please contact SOLTEC