Features of the Laser Joining Method:
- Accurate and efficient work can be conducted by feeding the solder wire from a solder feeder.
- Soldering to small and narrow area or to high heat dissipation components, where soldering using a soldering iron is difficult, can be achieved.
- If dual pulse type is used, two (2) laser spots are emitted from one (1) laser head enabling simultaneous soldering on two (2) points.
Chip Resistor FPC Coil
DIP Component Solder Bumps Insulated Wire
Micro-Joining Application: Soldering by Laser
SMT components, DIP components and insulated wires can be soldered without contact onto PWB patterns or terminals.
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Applicable Machine Models:
- Laser System LW-S100
- Laser Power Supply LW-D30
For configuration assistance, please contact SOLTEC