LCD Module Assembly

Features of Pulse Heat Joining

When soldering or thermo-compression joining of flexible circuits, such as the TAB or the FFC, highly reliable joining can be realized without lifting up or misalignment by employing the pulse heat method where heating and cooling are conducted with the pressure being applied.

                       The Entire LCD Module                                     Enlarged View of Section A


Joining One (1): Joining of TAB on LCD Panel

Connection of LCD (ITO Pattern) and the TAB is realized by the pulse heat method via a tape material called ACF (Anisotropic Conductive Film) which contains conductive particles. High pressure and uniform pressure and temperature distribution are realized by the pulse heat method.

Joining Two (2): Joining of TAB and PWB (Driver Circuit)

TAB and PWB are connected by pulse heating via solder. Normally, solder is previously applied on the PWB side pattern.

Joining Three (3): Joining of PWB (Driver Circuit) and Mother Board

FFC (Flexible Flat Cable) is used for connection of LCD Module and the main board (mother board). Similar to the case of Joining Two (2), solder is previously applied on the PWB side pattern prior to the pulse heat connection.

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Applicable Machine Models:

  • Pulse Heat Power Supply, General Purpose Type TCW-315
  • Pulse Heat Power Supply, High Power Type PHU-35
  • Pulse Heat System Head NA-11 Series & NA-15 Series
  • Pulse Heat Bonder TCW-125